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 SEMICONDUCTOR
TECHNICAL DATA
General Description
It's mainly suitable for use as a load switch in battery powered applications.
KMA2D4P20S
P-Ch Trench MOSFET
FEATURES
VDSS=-20V, ID=-2.4A. Drain-Source ON Resistance. : RDS(ON)=100m (Max.) @ VGS=-4.5V.
A
2
E B
3
: RDS(ON)=175m (Max.) @ VGS=-2.5V.
1
DIM MILLIMETERS _ A 2.926 + 0.05 _ B 1.626 + 0.05 1.25 MAX C _ D 0.40 + 0.05 _ E 2.80 + 0.15 _ G 1.90 + 0.10 _ H 0.95 + 0.05 _ J 0.15 + 0.05 0.00 ~ 0.10 K _ M 0.45 + 0.08 _ N 1.10 + 0.05
G
C
N
H
M
MAXIMUM RATING (Ta=25
CHARACTERISTIC Drain-Source Voltage Gate-Source Voltage Drain Current DC
)
SYMBOL VDSS VGSS ID * IDP* IS * PD * Tj Tstg RthJA * RATING -20 12 -2.4 -9 -0.9 1.0 0.6 150 -55 150 125 /W UNIT V V A A W
K
SOT-23
Pulsed (Note1)
Source-Drain Diode Current Drain Power Dissipation Ta=25 Ta=100
PIN CONNECTION
Top View
D
3
Maximum Junction Temperature Storage Temperature Range Thermal Resistance, Junction to Ambient * : Surface Mounted on 1
1 FR4 Board, t 5sec.
2
J
D
1
G
S
2006. 4. 6
Revision No : 0
1/5
KMA2D4P20S
ELECTRICAL CHARACTERISTICS (Ta=25
CHARACTERISTIC Static Drain-Source Breakdown Voltage Drain Cut-off Current Gate Threshold Voltage Gate Leakage Current Drain-Source ON Resistance ON State Drain Current Forward Transconductance Source-Drain Diode Forward Voltage Dynamic (Note 2) Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-on Delay time Turn-on Rise time Turn-off Delay time Turn-off Fall time Note 1) Pulse test : Pulse width 300 Qg Qgs Qgd td(on) tr td(off) tf , Duty Cycle 2%. VDS=-15V, RL=5.6 , VGS=-4.5V, RG=6 (Fig.2) VDS=-15V, RD=5.6 VGS=-4.5V (Fig.1) 4 0.6 1.4 6.5 13 15 20 ns nC BVDSS IDSS Vth IGSS RDS(ON) ID(ON) gfs VSD ID=-250 A, VGS=0V, VGS=0V, VDS=-20V VGS=0V, VDS=-16V, Tj=70 VDS=VGS, ID=-250 A VGS= 12V, VDS=0V (Note 1) (Note 1) (Note 1) (Note 1) (Note 1) -20 -0.6 -9 88 146 4 -1 -5 100 100 175 -1.3 V A V nA m A S V
)
TEST CONDITION MIN. TYP. MAX. UNIT
SYMBOL
VGS=-4.5V, ID=-2.4A VGS=-2.5V, ID=-1.8A VGS=-4.5V, VDS=-5V VDS=-5V, ID=-2.4A IS=-2.4A, VGS=0V
Note 2) Guaranteed by design. Not subject to production testing.
2006. 4. 6
Revision No : 0
2/5
KMA2D4P20S
ID - VDS
-9 -8 -4V -4.5V -5V -2.5V -3.5V -9 -3V -8 VD = VG
ID - VGS
-7 -6 -5 -4 -3 -2 -1
Drain Current ID (A)
Drain Current ID (A)
-7 -6 -5 -4 -3 -2 -1
Tj=25 C
Tj= -55 C
Tj=125 C
-2V
VGS = -1.5V
0 0
-1 -2 -3
0 0
-1 -2 -3 -4 -5
Drain - Source Voltage VDS (V)
Gate - Source Voltage VGS (V)
Vth - Tj
Normalized Threshold Voltage Vth
0.4 300
RDS(ON) - ID
On - Resistance RDS(ON) (m)
Ta=25 C
ID= -250A
0.3 0.2 0.1 0 -0.1 -0.2 -75
250 200 150 100
VGS = -4.5V VGS = -2.5V
50 0
-50
-25
0
25
50
75
100 125 150
0
-2
-4
-6
-8
Junction Temperature Tj ( C)
Drain Current ID (A)
IS - VSD
-100
RDS(ON) - Tj
1.6
VGS = -4.5V IDS =-2.7A
Reverse Drain Current IS (A)
Normalized On Resistance
Tj=150 C
1.4 1.2 1.0 0.8 0.6
-10
Tj=25 C
-1
-0.1
0
-0.2
-0.4
-0.6
-0.8
-1
-1.2
-75
-50
-25
0
25
50
75
100 125 150
Source - Drain Voltage VSD (V)
Junction Temperture Tj ( C )
2006. 4. 6
Revision No : 0
3/5
KMA2D4P20S
C - VDS
750 600
-5
Qg - VGS
Gate - Source Voltage VGS (V)
Frequency = 1MHz VD = -15V ID = -2.7A
-4
Capacitance (pF)
450 300 150
Crss
-3
Ciss
-2
Coss
-1
0
0 0 1 2 3 4 5
0
-5
-10
-15
-20
Drain - Source Voltage VDS (V)
Gate - Charge Qg (nC)
Rth
Normalized Transient Thermal Resistance
101
1
10-1
0.5 0.2 0.1 PDM t1 t2 Single Pluse
10-2
0.02 0.01
10-3 10-4
- Duty Factor, D= t1/t2 Tj(max) - Tc - RthJC = PD 10-1 1 101 102 103
10-3
10-2
Square Wave Pulse Duration (sec)
2006. 4. 6
Revision No : 0
4/5
KMA2D4P20S
Fig. 1 Gate Charge
VGS -4.5 V
Schottky Diode
ID
0.5
VDSS 1.0 mA
ID
VDS
VGS
Q Qgs Qgd Qg
Fig. 2 Resistive Load Switching
RL
td(on)
ton tr
td(off)
toff tf
0.5 VDSS 6 VDS
VGS
10%
-4.5 V
VGS
VDS
90%
2006. 4. 6
Revision No : 0
5/5


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